L400 UHV Sputtering System for multilayer deposition
The L400 UHV magnetron sputtering system is designed for sequential sputtering with movable magnetrons. Conventional sequential sputtering systems with rotating planetary substrate stage provide limited substrate manipulation facilities. In the L400 design the substrate stage is stationary and the magnetrons are moved in sequence of the deposited multilayer. This allows the use of substrate masking with movable shutters, RF and DC substrate bias, wedge deposition and azimuthal substrate rotation - features not available in any other sputtering system.
The L400 deposition chamber has a differentially pumped main flange for quick access to the magnetrons. The magnetron movement and indexing is fully computer controlled allowing recipe based deposition of multilayer thin films.
The system can be used for sputtering of metals, insulators and magnetic materials using either RF or DC sputtering. The maximum target size is 4" in diameter.
The UHV robotic handler is used for substrate transfer between the process chambers and the load lock. The same handler can pick and place various masks on top of the substrate.
The photo on the left shows the UHV robot with load lock and mask storage chambers. The UHV robotic handler chamber has eight positions for various tools and process chambers.
The photo shows the L400 sputtering system combined with a co-deposition sputtering chamber connected to the UHV wafer handler. This system was delivered to the Center of Advanced European Studies and Research (Caesar) in Bonn, Germany.